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JEDEC JESD 82-28AFULLY BUFFERED DIMM DESIGN FOR TEST, DESIGN FOR VALIDATION (DFx)standard by JEDEC Solid State Technology Association, 07/01/2008
JEDEC JESD94AAPPLICATION SPECIFIC QUALIFICATION USING KNOWLEDGE BASED TEST METHODOLOGYstandard by JEDEC Solid State Technology Association, 07/01/2008
JEDEC JEP 143B.01SOLID STATE RELIABILITY ASSESSMENT QUALIFICATION METHODOLOGIESstandard by JEDEC Solid State Technology Association, 06/01/2008
JEDEC JESD204ASERIAL INTERFACE FOR DATA CONVERTERSstandard by JEDEC Solid State Technology Association, 04/01/2008
JEDEC JESD22-B106DRESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICESstandard by JEDEC Solid State Technology Association, 04/01/2008
JEDEC JESD8-18AFBDIMM SPECIFICATION: HIGH SPEED DIFFERENTIAL PTP LINK AT 1.5 Vstandard by JEDEC Solid State Technology Association, 03/01/2008
JEDEC J-STD-020D.01JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SOLID STATE SURFACE-MOUNT DEVICESstandard by JEDEC Solid State Technology Association, 03/01/2008
JEDEC JESD 22-B114MARK LEGIBILITYstandard by JEDEC Solid State Technology Association, 03/01/2008
JEDEC JESD 79FDOUBLE DATA RATE (DDR) SDRAM SPECIFICATIONstandard by JEDEC Solid State Technology Association, 02/01/2008
JEDEC JEP153CHARACTERIZATION AND MONITORING OF THERMAL STRESS TEST OVEN TEMPURATURESstandard by JEDEC Solid State Technology Association, 01/01/2008
JEDEC JEP154GUIDELINE FOR CHARACTERIZING SOLDER BUMP ELECTROMIGRATION UNDER CONSTANT CURRENT AND TEMPERATURE STRESSstandard by JEDEC Solid State Technology Association, 01/01/2008
JEDEC JESD22-A120ATEST METHOD FOR THE MEASUREMENT OF MOISTURE DIFFUSIVITY AND WATER SOLUBILITY IN ORGANIC MATERIALS USED IN INTEGRATED CIRCUITSstandard by JEDEC Solid State Technology Association, 01/01/2008