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JEDEC JESD 78BIC LATCH-UP TESTstandard by JEDEC Solid State Technology Association, 12/01/2008
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JEDEC JESD15-1COMPACT THERMAL MODEL OVERVIEWstandard by JEDEC Solid State Technology Association, 10/01/2008
JEDEC JESD15THERMAL MODELING OVERVIEWstandard by JEDEC Solid State Technology Association, 10/01/2008
JEDEC JESD22-A113FPRECONDITIONING OF PLASTIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTINGstandard by JEDEC Solid State Technology Association, 10/01/2008
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JEDEC JESD201AENVIRONMENTAL ACCEPTANCE REQUIREMENTS FOR TIN WHISKER SUSCEPTIBILITY OF TIN AND TIN ALLOY SURFACE FINISHEDstandard by JEDEC Solid State Technology Association, 08/01/2008
JEDEC JESD30EDESCRIPTIVE DESIGNATION SYSTEM FOR SEMICONDUCTOR-DEVICE PACKAGESstandard by JEDEC Solid State Technology Association, 08/01/2008
JEDEC JEP 155RECOMMENDED ESD TARGET LEVELS FOR HBM/MM QUALIFICATIONstandard by JEDEC Solid State Technology Association, 08/01/2008
JEDEC JESD51-31THERMAL TEST ENVIRONMENT MODIFICATIONS FOR MULTICHIP PACKAGESstandard by JEDEC Solid State Technology Association, 07/01/2008
JEDEC JESD15-3TWO-RESISTOR COMPACT THERMAL MODEL GUIDELINEstandard by JEDEC Solid State Technology Association, 07/01/2008
JEDEC JESD 22-A121A (R2014)MEASURING WHISKER GROWTH ON TIN AND TIN ALLOY SURFACE FINISHESstandard by JEDEC Solid State Technology Association, 07/01/2008