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JEDEC JESD22-B112APACKAGE WARPAGE MEASUREMENT OF SURFACE-MOUNT INTEGRATED CIRCUITS AT ELEVATED TEMPERATUREstandard by JEDEC Solid State Technology Association, 10/01/2009
JEDEC JESD 84-C44EMBEDDED MULTIMEDIACARD (e-MMC) MECHANICAL STANDARD, WITH OPTIONAL RESET SIGNALstandard by JEDEC Solid State Technology Association, 07/01/2009
JEDEC JESD51-13Glossary of Thermal Measurement Terms and Definitionsstandard by JEDEC Solid State Technology Association, 06/01/2009
JEDEC JEP 106AASTANDARD MANUFACTURERS IDENTIFICATION CODEstandard by JEDEC Solid State Technology Association, 04/01/2009
JEDEC JIG 101 Ed. 2.0Material Composition Declaration for Electronic Productsstandard by JEDEC Solid State Technology Association, 04/01/2009
JEDEC JEP156CHIP-PACKAGE INTERACTION UNDERSTANDING, IDENTIFICATION AND EVALUATIONstandard by JEDEC Solid State Technology Association, 03/01/2009
JEDEC JESD 209A-1Addendum No. 1 to JESD209A - LOW POWER DOUBLE DATA RATE (LPDDR) SDRAM, 1.2 V I/Ostandard by JEDEC Solid State Technology Association, 03/01/2009
JEDEC JESD22-A104DTEMPERATURE CYCLINGstandard by JEDEC Solid State Technology Association, 03/01/2009
JEDEC JESD22-A101CSTEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TESTstandard by JEDEC Solid State Technology Association, 03/01/2009
JEDEC JS 9703IPC/JEDEC-9703: Mechanical Shock Test Guidelines for Solder Joint Reliabilitystandard by JEDEC Solid State Technology Association, 03/01/2009
JEDEC JEP 122EFAILURE MECHANISMS AND MODELS FOR SEMICONDUCTOR DEVICESstandard by JEDEC Solid State Technology Association, 03/01/2009
JEDEC JESD82-20AFBDIMM: ADVANCED MEMORY BUFFER (AMB)standard by JEDEC Solid State Technology Association, 03/01/2009