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JEDEC JESD 22-A117BELECTRICALLY ERASABLE PROGRAMMABLE ROM (EEPROM) PROGRAM/ERASE ENDURANCE AND DATA RETENTION TESTstandard by JEDEC Solid State Technology Association, 03/01/2009
JEDEC JESD 22-A110CHIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST)standard by JEDEC Solid State Technology Association, 01/01/2009
JEDEC JEP146AGUIDELINES FOR SUPPLIER PERFORMANCE RATINGstandard by JEDEC Solid State Technology Association, 01/01/2009
JEDEC JESD22-B109AFLIP CHIP TENSILE PULLstandard by JEDEC Solid State Technology Association, 01/01/2009
JEDEC JESD22-A114FELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING HUMAN BODY MODEL (HBM)standard by JEDEC Solid State Technology Association, 12/01/2008
JEDEC JEP 148ARELIABILITY QUALIFICATION OF SEMICONDUCTOR DEVICES BASED ON PHYSICS OF FAILURE RISK AND OPPORTUNITY ASSESSMENTstandard by JEDEC Solid State Technology Association, 12/01/2008
JEDEC JESD 78BIC LATCH-UP TESTstandard by JEDEC Solid State Technology Association, 12/01/2008
JEDEC JESD50B.01SPECIAL REQUIREMENTS FOR MAVERICK PRODUCT ELIMINATION AND OUTLIER MANAGEMENTstandard by JEDEC Solid State Technology Association, 11/01/2008
JEDEC JESD15-1COMPACT THERMAL MODEL OVERVIEWstandard by JEDEC Solid State Technology Association, 10/01/2008
JEDEC JESD15THERMAL MODELING OVERVIEWstandard by JEDEC Solid State Technology Association, 10/01/2008
JEDEC JESD22-A113FPRECONDITIONING OF PLASTIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTINGstandard by JEDEC Solid State Technology Association, 10/01/2008
JEDEC JESD201AENVIRONMENTAL ACCEPTANCE REQUIREMENTS FOR TIN WHISKER SUSCEPTIBILITY OF TIN AND TIN ALLOY SURFACE FINISHEDstandard by JEDEC Solid State Technology Association, 08/01/2008