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  IEC 61190-1-3 Ed. 2.0 b:2007

  IEC 61190-1-3 Ed. 2.0 b:2007Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applicationsstandard by International Electrotechnical Commission, 04/26/2007

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  IEC 61190-1-2 Ed. 2.0 b:2007

  IEC 61190-1-2 Ed. 2.0 b:2007Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assemblystandard by International Electrotechnical Commission, 04/26/2007

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  IEC 61988-4 Ed. 1.0 b:2007

  IEC 61988-4 Ed. 1.0 b:2007 [ Withdrawn ]Plasma display panels - Part 4: Climatic and mechanical testing methodsstandard by International Electrotechnical Commission, 04/26/2007

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  IEC 61190-1-3 Ed. 2.0 en:2007

  IEC 61190-1-3 Ed. 2.0 en:2007Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applicationsstandard by International Electrotechnical Commission, 04/26/2007

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  IEC 61190-1-2 Ed. 2.0 en:2007

  IEC 61190-1-2 Ed. 2.0 en:2007Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assemblystandard by International Electrotechnical Commission, 04/26/2007

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  $151.36 $352.00 -57% In stock

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  IEC 60664-1 Ed. 2.0 b:2007

  IEC 60664-1 Ed. 2.0 b:2007 [ Withdrawn ]Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and testsstandard by International Electrotechnical Commission, 04/26/2007

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  IEC 60191-6-16 Ed. 1.0 en:2007

  IEC 60191-6-16 Ed. 1.0 en:2007Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGAstandard by International Electrotechnical Commission, 04/26/2007

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  IEC 60191-1 Ed. 2.0 b:2007

  IEC 60191-1 Ed. 2.0 b:2007Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devicesstandard by International Electrotechnical Commission, 04/24/2007

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  IEC 62282-3-1 Ed. 1.0 b:2007

  IEC 62282-3-1 Ed. 1.0 b:2007 [ Withdrawn ]Fuel cell technologies - Part 3-1: Stationary fuel cell power systems - Safetystandard by International Electrotechnical Commission, 04/24/2007

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  IEC 61788-4 Ed. 2.0 en:2007

  IEC 61788-4 Ed. 2.0 en:2007 [ Withdrawn ]Superconductivity - Part 4: Residual resistance ratio measurement - Residual resistance ratio of Nb-Ti composite superconductorsstandard by International Electrotechnical Commission, 04/24/2007

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  IEC 61760-2 Ed. 2.0 en:2007

  IEC 61760-2 Ed. 2.0 en:2007Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guidestandard by International Electrotechnical Commission, 04/24/2007

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  IEC 60793-1-42 Ed. 2.0 en:2007

  IEC 60793-1-42 Ed. 2.0 en:2007Optical fibres - Part 1-42: Measurement methods and test procedures - Chromatic dispersionstandard by International Electrotechnical Commission, 04/24/2007

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