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IEC 61190-1-3 Ed. 2.0 b:2007
IEC 61190-1-3 Ed. 2.0 b:2007Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applicationsstandard by International Electrotechnical Commission, 04/26/2007
$101.05 $235.00 -57%Reduced price!In stockIEC 61190-1-2 Ed. 2.0 b:2007
IEC 61190-1-2 Ed. 2.0 b:2007Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assemblystandard by International Electrotechnical Commission, 04/26/2007
$52.03 $121.00 -57%Reduced price!In stockIEC 61988-4 Ed. 1.0 b:2007
IEC 61988-4 Ed. 1.0 b:2007 [ Withdrawn ]Plasma display panels - Part 4: Climatic and mechanical testing methodsstandard by International Electrotechnical Commission, 04/26/2007
$52.03 $121.00 -57%Reduced price!In stockIEC 61190-1-3 Ed. 2.0 en:2007
IEC 61190-1-3 Ed. 2.0 en:2007Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applicationsstandard by International Electrotechnical Commission, 04/26/2007
$61.49 $143.00 -57%Reduced price!In stockIEC 61190-1-2 Ed. 2.0 en:2007
IEC 61190-1-2 Ed. 2.0 en:2007Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assemblystandard by International Electrotechnical Commission, 04/26/2007
$41.71 $97.00 -57%Reduced price!In stockIEC 60664-1 Ed. 2.0 b:2007
IEC 60664-1 Ed. 2.0 b:2007 [ Withdrawn ]Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and testsstandard by International Electrotechnical Commission, 04/26/2007
$151.36 $352.00 -57%Reduced price!In stockIEC 60191-6-16 Ed. 1.0 en:2007
IEC 60191-6-16 Ed. 1.0 en:2007Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGAstandard by International Electrotechnical Commission, 04/26/2007
$29.24 $68.00 -57%Reduced price!In stockIEC 60191-1 Ed. 2.0 b:2007
IEC 60191-1 Ed. 2.0 b:2007Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devicesstandard by International Electrotechnical Commission, 04/24/2007
$101.05 $235.00 -57%Reduced price!In stockIEC 62282-3-1 Ed. 1.0 b:2007
IEC 62282-3-1 Ed. 1.0 b:2007 [ Withdrawn ]Fuel cell technologies - Part 3-1: Stationary fuel cell power systems - Safetystandard by International Electrotechnical Commission, 04/24/2007
$128.57 $299.00 -57%Reduced price!In stockIEC 61788-4 Ed. 2.0 en:2007
IEC 61788-4 Ed. 2.0 en:2007 [ Withdrawn ]Superconductivity - Part 4: Residual resistance ratio measurement - Residual resistance ratio of Nb-Ti composite superconductorsstandard by International Electrotechnical Commission, 04/24/2007
$52.03 $121.00 -57%Reduced price!In stockIEC 61760-2 Ed. 2.0 en:2007
IEC 61760-2 Ed. 2.0 en:2007Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guidestandard by International Electrotechnical Commission, 04/24/2007
$18.49 $43.00 -57%Reduced price!In stockIEC 60793-1-42 Ed. 2.0 en:2007
IEC 60793-1-42 Ed. 2.0 en:2007Optical fibres - Part 1-42: Measurement methods and test procedures - Chromatic dispersionstandard by International Electrotechnical Commission, 04/24/2007
$47.30 $110.00 -57%Reduced price!In stock
