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IEC 61190-1-2 Ed. 2.0 b:2007

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IEC 61190-1-2 Ed. 2.0 b:2007 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

standard by International Electrotechnical Commission, 04/26/2007

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IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.

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Edition: 2.0 Published: 04/26/2007 Number of Pages: 37 File Size: 1 file , 1.6 MB