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New Reduced price! IEC 60191-6-21 Ed. 1.0 b:2010 View larger

IEC 60191-6-21 Ed. 1.0 b:2010

M00000590

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IEC 60191-6-21 Ed. 1.0 b:2010 Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

standard by International Electrotechnical Commission, 08/30/2010

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IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.