Could I help you?
> >IEC 62047-9 Ed. 1.0 b:2011
New Reduced price! IEC 62047-9 Ed. 1.0 b:2011 View larger

IEC 62047-9 Ed. 1.0 b:2011

M00000307

New product

IEC 62047-9 Ed. 1.0 b:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

standard by International Electrotechnical Commission, 07/13/2011

More details

In stock

$70.52

-57%

$164.00

More info

Full Description

IEC 62047-9:2011 describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly. The applicable wafer thickness is in the range of 10 ohmm to several millimeters.

Product Details

Edition: 1.0 Published: 07/13/2011 Number of Pages: 49 File Size: 1 file , 680 KB