No products

To be determined Shipping

$0.00 Total

Check out

Product successfully added to your shopping cart

Quantity

Total

There are 0 items in your cart. There is 1 item in your cart.

Total products

Total shipping To be determined

Total

Continue shopping Proceed to checkout

New Reduced price! IEC 62047-18 Ed. 1.0 b:2013

View larger

IEC 62047-18 Ed. 1.0 b:2013

Reference: M00004237

Condition: New product

IEC 62047-18 Ed. 1.0 b:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

standard by International Electrotechnical Commission, 07/17/2013

More details

In stock

More info

Full Description

IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.

Product Details

Edition: 1.0 Published: 07/17/2013 Number of Pages: 26 File Size: 1 file , 550 KB