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IEC 60191-6-4 Ed. 1.0 en:2003
M00000807
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IEC 60191-6-4 Ed. 1.0 en:2003 Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
standard by International Electrotechnical Commission, 06/11/2003
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