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IEC 61190-1-3 Ed. 1.0 b:2002

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IEC 61190-1-3 Ed. 1.0 b:2002 [ Withdrawn ] Attachment materials for electronic assembly - Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

standard by International Electrotechnical Commission, 03/22/2002

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Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications as well as for special electronic grade solders. This standard is a quality control document (not intended to relate directly to the material performance in the manufacturing process).

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Edition: 1.0 Published: 03/22/2002 Number of Pages: 65 File Size: 1 file , 590 KB