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IEC 61190-1-2 Ed. 1.0 b:2002

M00001903

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IEC 61190-1-2 Ed. 1.0 b:2002 [ Withdrawn ] Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly

standard by International Electrotechnical Commission, 03/22/2002

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Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).

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Edition: 1.0 Published: 03/22/2002 Number of Pages: 35 File Size: 1 file , 1.3 MB