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This Japanese Industrial Standard specifies test methods of copper-clad laminates for flexible printed wiring boards (hereafter referred to as 'copper-clad laminates').
| Author | JSA |
|---|---|
| Editor | JSA |
| Document type | Standard |
| Format | File |
| Confirmation date | 2014-10-20 |
| ICS | 31.180 : Printed circuits and boards |
| Number of pages | 30 |
| Cross references | IEC 60249-1 (1982), MOD |
| Year | 1990 |
| Document history | |
| Country | Japan |
| Keyword | JIS 6471;6471;JIS C 6471-1995 |