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1.1 This test method covers the determination of the volume resistivity of resin-based conductive adhesives in the cured condition. The test is made on a thin adhesive layer as prepared in a bonded specimen. This test method is used for conductive adhesives that are cured either at room temperature or at elevated temperatures.
| Author | ASTM |
|---|---|
| Editor | ASTM |
| Document type | Standard |
| Format | File |
| Confirmation date | 2017-11-01 |
| ICS | 83.180 : Adhesives |
| Number of pages | 3 |
| Replace | ASTM D2739-97(2010) |
| Set | ASTMVOL1506 |
| Year | 1990 |
| Document history | ASTM D2739-97(2010) |
| Country | USA |
| Keyword | ASTM 2739;ASTM D2739;ASTM D2739;10.1520/D2739-97R17 |