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1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their melting points. Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not covered by this specification as they are under the auspices of IPC – Association Connecting Electronic Industries.
1.1.1 These solders include those alloys having a liquidus temperature not exceeding 800°F (430°C).
| Author | ASTM |
|---|---|
| Editor | ASTM |
| Document type | Standard |
| Format | File |
| Confirmation date | 2014-10-01 |
| ICS | 25.160.50 : Brazing and soldering 77.150.60 : Lead, zinc and tin products |
| Number of pages | 10 |
| Replace | ASTM B32-08 |
| Set | ASTMVOL0204 |
| Year | 2008 |
| Document history | ASTM B32-08 |
| Country | USA |
| Keyword | ASTM 32;ASTM B32;ASTM B32;10.1520/B0032-08R14 |