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ASTM B885-09(2015)

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ASTM B885-09(2015)

Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts

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1.1 This test method defines a resistance probing test for detecting the presence of foreign matter on Printed Wiring Board (PWB) contacts or fingers that adversely affects electrical performance. This test method is defined specifically for such fingers coated with gold. Application of this test method to other types of electrical contacts or to fingers coated with other materials may be possible and desirable but may require some changes in fixturing, procedures, or failure criteria.

Author ASTM
Editor ASTM
Document type Standard
Format File
Confirmation date 2015-05-01
ICS 31.180 : Printed circuits and boards
Number of pages 3
Replace ASTM B885-09
Set ASTMVOL0204
Year 2009
Document history ASTM B885-09
Country USA
Keyword ASTM 885;ASTM B885;ASTM B885;10.1520/B0885-09R15