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ASTM D1867-13 + Redline
Standard Specification for Copper-Clad Thermosetting Laminates for Printed WiringMore info
1.1 This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards.
| Author | ASTM |
|---|---|
| Editor | ASTM |
| Document type | Standard |
| Format | File |
| ICS | 31.180 : Printed circuits and boards |
| Number of pages | 5 |
| Replace | ASTM D1867-07 + Redline |
| Set | ASTMVOL1001 |
| Year | 2013 |
| Document history | ASTM D1867-07 + Redline |
| Country | USA |
| Keyword | ASTM 1867;ASTM D1867;ASTM D1867;10.1520/D1867-13 |