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ASTM F3147-15
Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel BendMore info
1.1 This test method covers a means to test a completed Surface Mounted Device (SMD) joint for bond strength and inter-layer stress compatibility
| Author | ASTM |
|---|---|
| Editor | ASTM |
| Document type | Standard |
| Format | File |
| ICS | 31.020 : Electronic components in general |
| Number of pages | 3 |
| Set | ASTMVOL1004 |
| Year | 2015 |
| Document history | |
| Country | USA |
| Keyword | ASTM 3147;ASTM F3147;ASTM F3147;10.1520/F3147-15 |