ASTM D7005/D7005M-16 + Redline

1.1 It has been widely discussed in the literature that bond strength of flexible multi-ply materials is difficult to measure with current technology. The above is recognized and accepted, since all known methods of measurement include the force required to bend the separated layers, in addition to that required to separate them. However, useful information can be obtained when one realizes that the bending force is included and that direct comparison between different materials, or even between the same materials of different thickness, cannot be made. Also, conditioning that affects the moduli of the plies will be reflected in the bond strength measurement.