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ASTM F3192-16
Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) MettalizationMore info
1.1 This specification details the generic criteria requirements of high pure copper sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advanced packaging.
| Author | ASTM |
|---|---|
| Editor | ASTM |
| Document type | Standard |
| Format | File |
| ICS | 25.220.40 : Metallic coatings |
| Number of pages | 5 |
| Set | ASTMVOL1004 |
| Year | 2016 |
| Country | USA |
| Keyword | ASTM 3192;ASTM F3192;ASTM F3192;10.1520/F3192-16 |