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ASTM F72-17

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ASTM F72-17

Standard Specification for Gold Wire for Semiconductor Lead Bonding

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1.1 This specification covers round drawn/extruded gold wire for internal semiconductor device electrical connections. Four classifications of wire are distinguished, (1) copper-modified wire, (2) beryllium-modified wire, (3) high-strength wire, and (4) special purpose wire.

Note 1: Trace metallic elements have a significant effect upon the mechanical properties and thermal stability of high-purity gold wire. It is customary in manufacturing to add controlled amounts of selected impurities to gold to modify or stabilize bonding wire properties, or both. This practice is known variously as “modifying,” “stabilizing,” or “doping.” The first two wire classifications denoted in this specification refer to wire made with either of two particular modifiers, copper or beryllium, in general use. In the third and fourth wire classifications, “high-strength” and “special purpose” wire, the identity of modifying additives is not restricted.

Author ASTM
Editor ASTM
Document type Standard
Format File
Number of pages 11
Replace ASTM F72-06
Set ASTMVOL1004
Year 2017
Document history ASTM F72-06
Country USA
Keyword ASTM 72;ASTM F72;ASTM F72;10.1520/F0072-17