ASTM F2873-18 + Redline

1.1 This practice covers the installation of self-leveling underlayments, which may include a priming system, over solid wood, wood structural panel subfloors, over concrete, and over certain solidly bonded existing flooring systems such as epoxy floors, ceramic and natural stone tiles, terrazzo, metal subfloors and foils such as steel, copper and lead, solidly bonded patching and other leveling materials as well as properly prepared non water-soluble adhesive residues as recommended by the underlayment manufacturer. This practice also covers the preparation of the self-leveling underlayment’s surface prior to the installation of resilient flooring.