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BS EN 62047-27. Semiconductor devices. Micro-electromechanical Part 27. Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT) partTitleEN sectionTitleENMore info
| Author | BSI |
|---|---|
| Editor | BSI |
| Document type | Draft |
| Format | File |
| ICS | 31.080.99 : Other semiconductor devices |
| Number of pages | 16 |
| Cross references | IEC Document 47F/216/CD |
| Year | 2015 |
| Country | United Kingdom |