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Specifies the principle and method for scale adhesion testing for oxygen-free high conductivity copper, primarily for use in electronic devices involving glass to metal seals or other uses requiring an adherent film of copper oxide.
| Author | BSI |
|---|---|
| Editor | BSI |
| Document type | Standard |
| Format | File |
| Confirmation date | 1999-11-15 |
| EAN ISBN | 0 580 11265 9 |
| ICS | 77.040.99 : Other methods of testing of metals |
| Number of pages | 6 |
| Cross references | ISO 4746 |
| Year | 1980 |
| Country | United Kingdom |
| Keyword | BS 5909 ; BS5909 |