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ISO 16525-9:2014 specifies test methods to investigate the high-speed signal-transmission characteristics in the bonded portions of an isotropic electrically conductive adhesive, which joins the terminals of a surface mounted device (SMD) and the land grid patterns of a printed circuit board. It also investigates the characteristics of wiring with an isotropic electrically conductive adhesive, which can be applied on to the printed circuit board.
| Author | ISO/TC 61/SC 11 Products |
|---|---|
| Editor | ISO |
| Document type | Standard |
| Format | Paper |
| Edition | 1 |
| ICS | 83.180 : Adhesives |
| Number of pages | 45 |
| Weight(kg.) | 0.1765 |
| Year | 2014 |
| Country | Switzerland |