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ISO 9453:2014

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ISO 9453:2014

Soft solder alloys — Chemical compositions and forms

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ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

Author ISO/TC 44/SC 12 Soldering materials
Editor ISO
Document type Standard
Format Paper
Edition 3
ICS 25.160.50 : Brazing and soldering
Number of pages 16
Replace ISO 9453:2006
Weight(kg.) 0.1272
Year 2014
Country Switzerland