Cart 0 Product Products (empty)
No products
To be determined Shipping
$0.00 Total
Product successfully added to your shopping cart
Quantity
Total
There are 0 items in your cart. There is 1 item in your cart.
Total products
Total shipping To be determined
Total
New Sale! 
View larger
View larger ISO 9455-14:2017
New product
ISO 9455-14:2017
Soft soldering fluxes — Test methods — Part 14: Assessment of tackiness of flux residuesMore info
ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.
| Author | ISO/TC 44/SC 12 Soldering materials |
|---|---|
| Editor | ISO |
| Document type | Standard |
| Format | Paper |
| Edition | 2 |
| ICS | 25.160.50 : Brazing and soldering |
| Number of pages | 4 |
| Replace | ISO 9455-14:1991 |
| Weight(kg.) | 0.1068 |
| Year | 2017 |
| Country | Switzerland |