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SAE ARP 1612A:2014-08-14
Polyimide Printed Circuit Boards Fabrication ofMore info
This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.
| Author | SAE |
|---|---|
| Editor | SAE |
| Document type | Standard |
| Format | File |
| Confirmation date | 2014-08-14 |
| ICS | 49.025.40 : Rubber and plastics |
| Number of pages | 18 |
| Replace | SAE ARP 1612:1979-10-01 |
| Set | AEROPAKS10U-10 |
| Year | 2014 |
| Document history | |
| Country | USA |
| Keyword | SAE 1612;SAE ARP1612A;SAE ARP1612A;SAE ARP 1612 |