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IEC 60317-50:2012 specifies the requirements of glass-fibre wound resin or varnish impregnated, bare, grade 1 or grade 2 enamelled round copper winding wire, temperature index 200. The impregnating agent is silicone resin based. For this type of wire, the heat shock test is inappropriate and therefore a heat shock temperature cannot be established. Consequently, a class based on the requirements for temperature index and heat shock temperature cannot be specified. This edition includes the following significant technical changes with respect to the previous edition:
- addition of requirements for appearance, new subclause 3.3 and
- addition of pin hole test requirements, Clause 23: Pin hole test. Keywords: copper winding wire
This publication is to be read in conjunction with IEC 60317-0-6:2001.
| Author | International Electrotechnical Commission (IEC) |
|---|---|
| Published by | IEC |
| Document type | Standard |
| Format | File |
| Edition | 2.0 |
| ICS | 29.060.10 : Wires |
| Number of pages | 20 |
| Replace | IEC 60317-50 CEI 60317-50 |
| Cross references | DIN EN 60317-50 (2013-06), IDT |
| Year | 2012 |
| Document history | IEC 60317-50 (2012-07) |
| Country | Switzerland |
| Keyword | IEC60317;IEC 60317-50:2012 |