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IEC 61188-1-2 (1998-04)
IEC 61188-1-2:1998 Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedanceMore info
The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.
| Author | IEC |
|---|---|
| Editor | CEI |
| Document type | Standard |
| Format | File |
| Edition | 1.0 |
| ICS | 31.180 : Printed circuits and boards |
| Number of pages | 83 |
| Replace | IEC 52/758/FDIS (1997-12) |
| Cross references | DIN EN 61188-1-2 (1999-03), IDT |
| Year | 1990 |
| Document history | IEC 61188-1-2 (1998-04) |
| Country | Switzerland |
| Keyword | IEC61188;IEC 61188-1-2:1998 |