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Provides guidance on reliability stress screening techniques and procedures for electronic components. Is intended for use of a) component manufacturers as a guideline, b) component users as a guideline to negotiate with component manufacturers on stress screening requirements or plan a stress screening process in house due to reliability requirements, c) subcontractors who provide stress screening as a service.
| Author | IEC |
|---|---|
| Editor | CEI |
| Document type | Standard |
| Format | File |
| Edition | 1.0 |
| ICS | 03.120.01 : Quality in general 31.020 : Electronic components in general |
| Number of pages | 69 |
| Replace | IEC 56/636/FDIS (1998-06) |
| Cross references | BS IEC 61163-2 (1999-02-15), IDT |
| Year | 1990 |
| Document history | IEC 61163-2 (1998-11) |
| Country | Switzerland |
| Keyword | IEC61163;IEC 61163-2:1998 |