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IEC 61189-1 (1997-03)
IEC 61189-1:1997 Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodologyMore info
This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies.
| Author | IEC |
|---|---|
| Editor | CEI |
| Document type | Standard |
| Format | File |
| Edition | 1.0 |
| ICS | 31.180 : Printed circuits and boards |
| Number of pages | 37 |
| Replace | IEC 52/635/FDIS (1996-10) |
| Cross references | DIN EN 61189-1 (1997-10), IDT |
| Modified by | IEC 61189-1 AMD 1 (2001-08) |
| Year | 1990 |
| Document history | IEC 61189-1 (1997-03) |
| Country | Switzerland |
| Keyword | IEC61189;IEC 61189-1:1997 |