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IEC 60191-5 (1997-04)
IEC 60191-5:1997 Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)More info
Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.
| Author | IEC |
|---|---|
| Editor | CEI |
| Document type | Standard |
| Format | File |
| Edition | 2.0 |
| ICS | 31.080.01 : Semiconductor devices in general |
| Number of pages | 71 |
| Replace | IEC 47D/107/FDIS (1996-11) |
| Cross references | BS 3934-5 (1997-09-15), IDT |
| Year | 1990 |
| Document history | IEC 60191-5 (1997-04) |
| Country | Switzerland |
| Keyword | IEC60191;IEC 60191-5:1997 |