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IEC 61249-8-8 (1997-06)
IEC 61249-8-8:1997 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatingsMore info
Provides requirements for the qualification of temporary solder resist coatings. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.
| Author | IEC |
|---|---|
| Editor | CEI |
| Document type | Standard |
| Format | File |
| Edition | 1.0 |
| ICS | 31.180 : Printed circuits and boards |
| Number of pages | 19 |
| Replace | IEC 52/680/FDIS (1997-01) |
| Cross references | DIN EN 61249-8-8 (1998-01), IDT |
| Year | 1990 |
| Document history | IEC 61249-8-8 (1997-06) |
| Country | Switzerland |
| Keyword | IEC61249;IEC 61249-8-8:1997 |