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IEC/TR 62866 (2014-05)
IEC TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testingMore info
IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.
| Author | International Electrotechnical Commission (IEC) |
|---|---|
| Editor | CEI |
| Document type | Standard |
| Format | File |
| Edition | 1.0 |
| ICS | 31.180 : Printed circuits and boards |
| Number of pages | 187 |
| Replace | IEC 91/1102/DTR (2013-05) |
| Cross references | PD IEC/TR 62866 (2014-05-31), IDT |
| Year | 2014 |
| Document history | IEC/TR 62866 (2014-05) |
| Country | Switzerland |
| Keyword | IEC62866;IEC TR 62866:2014 |