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IEC 60749-42 (2014-08)
IEC 60749-42:2014 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storageMore info
IEC 60749-42:2014 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments. This test method is used to evaluate the endurance against corrosion of the metallic interconnection of chips of semiconductor devices contained in plastic moulded and other types of packages. It is also used as a means of accelerating the leakage phenomena due to the moisture penetration through the passivation film and as a pre-conditioning for various kinds of tests.
| Author | International Electrotechnical Commission (IEC) |
|---|---|
| Editor | CEI |
| Document type | Standard |
| Format | File |
| Edition | 1.0 |
| ICS | 31.080.01 : Semiconductor devices in general |
| Number of pages | 16 |
| Replace | IEC 47/2200/FDIS (2014-05) |
| Cross references | DIN EN 60749-42 (2015-05), IDT |
| Year | 2014 |
| Document history | IEC 60749-42 (2014-08) |
| Country | Switzerland |
| Keyword | IEC60749;IEC 60749-42:2014 |