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IEC/TS 62878-2-3 (2015-03)

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IEC/TS 62878-2-3 (2015-03)

IEC TS 62878-2-3:2015 Device embedded substrate - Part 2-3: Guidelines - Design guide

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IEC TS 62878-2-3:2015 describes the design guide of device embedded substrates. The design guide of device embedded substrate is essentially the same as that of various electronic circuit boards. This part of IEC 62878 enables a thorough understanding of circuit design, structure design, board design, board manufacturing, jisso (assembly processes) and tests of products. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.

Author IEC
Editor CEI
Document type Standard
Format File
Edition 1.0
ICS 31.180 : Printed circuits and boards
31.190 : Electronic component assemblies
Number of pages 50
Replace IEC 91/1143/DTS (2013-09)
Cross references PD IEC/TS 62878-2-3 (2015-04-30), IDT
Year 2015
Document history IEC/TS 62878-2-3 (2015-03)
Country Switzerland
Keyword IEC62878;IEC TS 62878-2-3:2015