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IEC TS 62878-2-1:2015 describes the basics of device embedding substrate. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.
Author | IEC |
---|---|
Editor | CEI |
Document type | Standard |
Format | File |
Edition | 1.0 |
ICS | 31.180 : Printed circuits and boards 31.190 : Electronic component assemblies |
Number of pages | 60 |
Replace | IEC 91/1142/DTS (2013-09) |
Cross references | PD IEC/TS 62878-2-1 (2015-04-30), IDT |
Year | 2015 |
Document history | IEC/TS 62878-2-1 (2015-03) |
Country | Switzerland |
Keyword | IEC62878;IEC TS 62878-2-1:2015 |