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IEC 62047-26:2016 specifies descriptions of trench structure and needle structure in a micrometer scale. In addition, it provides examples of measurement for the geometry of both structures. For trench structures, this standard applies to structures with a depth of 1 µm to 100 µm; walls and trenches with respective widths of 5 µm to 150 µm; and aspect ratio of 0,006 7 to 20. For needle structures, the standard applies to structures with three or four faces with a height, horizontal width and vertical width of 2 µm or larger, and with dimensions that fit inside a cube with sides of 100 µm. This standard is applicable to the structural design of MEMS and geometrical evaluation after MEMS processes.
Author | IEC |
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Editor | CEI |
Document type | Standard |
Format | File |
Edition | 1.0 |
ICS | 31.080.99 : Other semiconductor devices |
Number of pages | 57 |
Replace | IEC 47F/233/FDIS (2015-10) |
Cross references | DIN EN 62047-26 (2016-12), IDT |
Year | 2016 |
Document history | IEC 62047-26 (2016-01) |
Country | Switzerland |
Keyword | IEC62047;IEC 62047-26:2016 |