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IEC 62047-27 (2017-01)

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IEC 62047-27 (2017-01)

IEC 62047-27:2017 Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

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IEC 62047-27:2017(E) specifies a method for assessing the bond strength of glass frit bonded structures using micro-chevron-tests (MCT). It describes suitable sample geometry and provides guidance for the design of deviating sample geometries.
The micro-chevron-test is an experimental method to determine the fracture toughness _K_IC of brittle materials or bond interfaces using specifically designed test chips (micro-chevron-samples) under defined load conditions (crack opening mode I). Owing to its high precision and low variance, it is suitable for analysing the influence of different process parameters on bond strength as well as for quality assurance.

Author IEC
Editor CEI
Document type Standard
Format File
Edition 1.0
ICS 31.080.99 : Other semiconductor devices
Number of pages 16
Year 2017
Country International
Keyword IEC62047;IEC 62047-27:2017