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IEC 62899-402-1:2017(E) specifies the measurement methods of the widths of the printed patterns in printed electronics. These printed pattern widths are treated as two-dimensional on a substrate. When the patterns are definitely affected by three-dimensional configurations, these are specified in measurement methods for thickness in printed electronics.
| Author | IEC |
|---|---|
| Editor | CEI |
| Document type | Standard |
| Format | File |
| Edition | 1.0 |
| ICS | 31.180 : Printed circuits and boards |
| Number of pages | 12 |
| Year | 2017 |
| Country | International |
| Keyword | IEC62899;IEC 62899-402-1:2017 |