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IEC 61188-7:2017 establishes a consistent technique for the description of electronic component orientation, and their land pattern geometries. This facilitates and encourages a common data capture and transfer methodology amongst and between global trading partners.
This edition includes the following significant technical changes with respect to the previous edition:
a) Figure 1 has been corrected;
b) the term “rectangle” has generally been replaced by “polygon”;
c) level B has been indicated as preferred level for new libraries.
| Author | IEC |
|---|---|
| Editor | CEI |
| Document type | Standard |
| Format | File |
| Edition | 2.0 |
| ICS | 31.180 : Printed circuits and boards |
| Number of pages | 20 |
| Replace | IEC 61188-7 (2009-05) |
| Year | 2017 |
| Document history | IEC 61188-7 Corrigendum 1 (2009-07) IEC 61188-7 (2009-05) IEC 61188-7 Corri |
| Country | Switzerland |
| Keyword | IEC61188;IEC 61188-7:2017 |