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IEC 61191-4:2017(E) prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).
This edition includes the following significant technical changes with respect to the previous edition:
The requirements have been updated to be compliant with the acceptance criteria in IPC-A-610F.
| Author | IEC |
|---|---|
| Editor | CEI |
| Document type | Standard |
| Format | File |
| Edition | 2.0 |
| ICS | 31.240 : Mechanical structures for electronic equipment |
| Number of pages | 19 |
| Replace | IEC 61191-4 (1998-08) |
| Year | 2017 |
| Document history | IEC 61191-4 (1998-08) |
| Country | International |
| Keyword | IEC61191;IEC 61191-4:2017 |