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IEC/TR 62878-2-7 (2019-03)
IEC TR 62878-2-7:2019 Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boardsMore info
IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.
| Author | IEC |
|---|---|
| Editor | CEI |
| Document type | Standard |
| Format | File |
| Edition | 1.0 |
| ICS | 31.180 : Printed circuits and boards 31.190 : Electronic component assemblies |
| Number of pages | 12 |
| Year | 2019 |
| Country | International |
| Keyword | IEC62878;IEC TR 62878-2-7:2019 |