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This standard indicates the procedures used to convert existing DIP and flat packages for digital parts (SSI & MSI) to chip carrier packages.
| Author | EIA |
|---|---|
| Editor | EIA |
| Document type | Standard |
| Format | File |
| ICS | 33.040.50 : Lines, connections and circuits |
| Number of pages | 10 |
| Year | 1980 |
| Document history | |
| Country | USA |
| Keyword | EIA 11;11;EIA JESD11 |