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EIA-540GAAA:1993 (R2001)
Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic EquipmentMore info
The Burn-In Sockets of assessed quality covered by this Detail Specification shall have:
a) Maximum enclosure dimensions that include insertion cover and actuator hardware as illustrated in Figure 1.
b) A working voltage not exceeding 125 volts (rms)
c) Current not exceeding 1 ampere per pin
OBJECT
The object of this detail specification is to provide all information required for the identification and quality assessment of the Bum-In Sockets for Chip Carrier Packages that are defined by EIA/JEDEC Publication 95, MO-094. The sockets have solder tail leads. The information contained herein or by reference, is complete and sufficient for inspect ion purposes.
| Author | EIA |
|---|---|
| Editor | EIA |
| Document type | Standard |
| Format | File |
| Confirmation date | 2001-04-06 |
| ICS | 31.220.10 : Plug-and-socket devices. Connectors |
| Number of pages | 20 |
| Cross references | ANSI/EIA-540GAAA (1993), IDT |
| Modified by | Includes all amendments and changes through Stabilization Notice (No longer revised / updated) , May 2013 |
| Year | 1990 |
| Document history | |
| Country | USA |
| Keyword | EIA 540GA;540GA |