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This document provides guidance regarding design considerations, material assessment techniques, and recommendations for material acceptance prior to use in Hybrid / MCM Products. As part of the risk assessment process, both technical requirements and cost should be carefully considered with regard to testing / evaluating the elements of a hybrid microcircuit or Multi-chip Module (MCM) prior to material release for assembly. The intent of this document is to highlight various options that are available to the Hybrid / MCM manufacturer and provide associated guidance, not to impose a specific set of tests.
| Author | EIA |
|---|---|
| Editor | EIA |
| Document type | Standard |
| Format | File |
| Confirmation date | 2009-09-01 |
| ICS | 31.200 : Integrated circuits. Microelectronics |
| Number of pages | 32 |
| Year | 2002 |
| Document history | |
| Country | USA |
| Keyword | EIA 142;142;EIA JEP142 |