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EIA TSB 144:2003 (R2012)
Adhesive Bubbles and Voids in Fiber Optic Components: Guidance, Issues and ChallengesMore info
The bulletin is applicable to fiber optic component reliability. The document is written for fiber optic component manufacturers, as well as end-users, and was prepared by TIA Working Group FO-6.3.1, Adhesives Reliability under the cognizance of FO-6.3 SC Subcommittee on Interconnecting Devices and Passive Products.
| Author | EIA |
|---|---|
| Editor | EIA |
| Document type | Standard |
| Format | File |
| Confirmation date | 2012-01-01 |
| ICS | 33.180.20 : Fibre optic interconnecting devices |
| Number of pages | 24 |
| Year | 2003 |
| Document history | |
| Country | USA |
| Keyword | EIA 144;144;EIA TSB-144 |