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The purpose of this test method is to define a standard Electrical Test Method (ETM) that can be used to determine the thermal characteristics of single integrated circuit devices housed in some form of electrical package. This method will provide a basis for comparison of different devices housed in the same electronic package or similar devices housed in different electronic packages.
| Author | EIA |
|---|---|
| Editor | EIA |
| Document type | Standard |
| Format | File |
| ICS | 31.080.01 : Semiconductor devices in general |
| Number of pages | 36 |
| Year | 1990 |
| Document history | |
| Country | USA |
| Keyword | EIA JESD 51;EIA 51;EIA 51.1;51;EIA JESD51-1 |