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The purpose of these tests is to evaluate materials and/or connector/socket assemblies as they are impacted by the effects of high humidity and heat. These tests are intended to be non-condensing.
| Author | EIA |
|---|---|
| Editor | EIA |
| Document type | Standard |
| Format | File |
| ICS | 29.120.20 : Connecting devices |
| Number of pages | 21 |
| Replace | EIA-364-31E (2017-04) |
| Year | 2019 |
| Country | USA |
| Keyword | EIA 364;EIA 364.32G;EIA-364;364 |